- Product description
- Media & Downloads
Features and benefits:
LOCTITE ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven.
The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008 should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.
- Electrically conductive
- Snap curable after B-stage
- Thermally conductive
- Low modulus
Technical data:
Size: 453 g
Color: Black
Applications: Die Attach
Coefficient of thermal expansion (CTE): 42.0 ppm/°C
Cure type: Heat Cure
Extractable ionic content, Chloride (CI-): 4.0 ppm
Extractable ionic content, Sodium (Na+): 4.0 ppm
Hot die shear strength: 2.6 kg-f
RT die shear strength: 6.0 kg-f
Tensile modulus, @ 250.0 °C: 1800.0 N/mm² (261070.0 psi )